SMSE

Faculty, by Name

Ming LI

Ming LI

Platform:
Advanced Materials Research Center
Title:
Professor
Office:
Room 413, Material Building D
Tel:
+86-21-3420-2542
Fax:
 
Email:
mingli90@sjtu.edu.cn
URL:
 

Biographical Information

Educational Background:

1994–1998:  Ph.D., Kyushu Institute of Technology, Japan

1983–1985:  M.S., Northeastern University, Applied Chemistry, China

1978–1982:  B.S., Northeastern University, Basic Chemistry, China

Professional Appointments:

2009–Present: Dean, Research Center of Advanced Materials, School of Materials Science and Engineering, Shanghai Jiao Tong University, China

2003–Present: Professor, School of Materials Science and Engineering, Shanghai Jiao Tong University, China

1998–2003: Senior Researcher and Section Chief, Research & Development

Department, Mitsui High-tec Co., Ltd., Japan

1993–1994: Visiting Scholar, Kyushu Institute of Technology, Japan

1991–1993: Visiting Scholar, Central Research Institute, C.Uyemura & Co.,Ltd., Japan

1988–1991: Lecturer, Institute of Surface Technology, Northeastern University, China

1986–1988: Assistant, Institute of Surface Technology, Northeastern University, China

 

Teaching Involvements

1. Science and Engineering of Microelectronic Fabrication for undergraduates

2. Modern Microelectronics Packaging Materials and Packaging Technology for Graduates

 

Selected Publications

Papers

[1] Tao Hang, Anmin Hu, Ming Li, Dali Mao, Structural Control of Cobalt Nanocones Array Grown by Directional Electrodeposition, CrystEngComm,2010,12:2799-2802

[2] Tao Hang, Huiqin Ling, Anmin Hu, Ming Li, Growth Mechanism and Field Emission Properties of Nickel Nanocones Array Fabricated by One-Step Electrodeposition, J. Electrochem. Soc.,2010,157(12):624-627

[3] Tao Hang, Li M., Mao D.L., Characterization of nickel nanocones routed by electrodeposition without any template, Nanotechnology, 2008,19(3): 035201

[4] Jin Hu, Anmin Hu, Ming Li, Dali Mao, Depressing effect of 0.1 wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging, Materials Characterization, 2010,61:355-361

[5] Tao Hang, Anmin Hu, Ming Li, Dali Mao, super-hydrophobic Nickel films with micro-nano hierarchical structure prepared by electrodeposition, Applied Surface Science, 2010,256: 2400-2404

[6] Jie Gao, Anmin Hu, Ming Li, Dali Mao, Influence of crystal orientation on copper oxidation failure, Applied Surface Science, 2009,255: 5943-5947

[7] Xi Chen, Anmin Hu, Ming Li, Dali Mao, Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion, Journal of Electronic Materials, 2009,38: 372-378

[8] Xi Chen, Anmin Hu, Ming Li, Dali Mao, Effect of a trace of Cr on intermetallic compound layer for tin/zinc lead-free solder joint during aging, Journal of Alloys and Compounds,2009,470: 429–433

[9] Xi Chen, Anmin Hu, Ming Li, Hong Shen, Dali Mao, Study on the Properties of Sn-9Zn-xCr Lead-free Solder, Journal of Alloys and Compounds, 2008,460(1): 478-484

[10] Dongyan Ding, Congqin Ning, Lin Huang, Fangchun Jin, Yongqiang Hao, Shuo Bai, Yan Li, Ming Li, Dali Mao, Anodic fabrication and bioactivity of Nb–doped TiO2 nanotubes, Nanotechnology,2009,20(30):305103

Professional Books

[1] Editor, IC Lead frame plating Technology,in Japanese, Mitsui High-tec Co., Ltd.

[2] Co-author, Electroplating Manual, China Machine Press, 2010.4