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Materials Frontier No.122

Title:Plating Technology for Electronic Devices from Past to Future in Japan

Speaker:Ichiro Koiwa,Professor of Materials Science and Engineering,Kanto Gakuin University, Tokyo, Japan

Date/Time: 2013-11-19,14:00-16:00

Venue: Room.308, Material Building A

Inviter: Dr. Tao HANG


  Dr. Ichiro Koiwa is Professor of Science and Engineering of Kanto Gakuin University. He was bone in Tokyo in 1958. He wrote his graduation thesis on “Electroless Co-Ni-Re-Mn-P Plated Films for Perpendicular Magnetic Recording” in 1982 at Waseda University. He wrote his master’s thesis on “Electroless Co-Ni-Re-P Plated Films for Perpendicular Magnetic Recording” in 1984 at Waseda University. He wrote his doctoral thesis on “An Application of Electroless Plating Film to Electronic Materials Perpendicular Magnetic Recording Media!” in 1987 at Waseda University. He worked as associate researcher from 1986 to 1988 at Waseda University and stated to work at Oki Electric Industry Co. Ltd. His main interest has been film technologies, he had been investigated film technologies, first he investigated thick film technologies such as screen printed film for a plasma display panel and then he investigated thin film technologies such as plating, sputtering chemical vapor deposition and coating for a ferroelectric random access memory (FeRAM) and high density packaging technologies. In 2005, he started to work at Kanto Gakuin University as professor and his main interest is plating film for electronic devices and high density packaging technologies.


1. Introduction of Kanto Gakuin University
1.1. Present Our Campus
1.1.1. General Introduction
1.1.2. High-tech research center
1.2. Past Our Campus
2. History of Japanese Plating Technology
2.1. My Student Days
2.2. Traditional Plating Laboratories
2.3. Two Main Topics in Plating Technology in the World
3. Recent Japanese Plating Technology
3.1. High Density Packaging Technology
3.2. Wafer-level Chip Size Packaging (W-CSP)
3.3. Embedded Technology
3.4. Thorough Silicon Via for Chip Stacking
3.5. Connection between FPC and ITO
3.6. Electrical Conductive Particles for Anisotropic Conductive Films
4. Introduction of Future Japanese Plating Technology
4.1. Plating for Medical Care
4.2. Plating from Non-Aqueous Solution
4.2.1. Plating form Organic Solution
4.2.2. Plating from Ionic Liquid Solution
4.3. Composite Plating Using Nano-Powder
4.3.1. Reactive Composite Plating
4.3.2. Composite Plating from Non-aqueous Solution
4.3.3. Composite Films from Non-Suspended Solution

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