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Faculty

Name: Huiqin LING

Title: Associate Professor

Office: Room 411, Material Building D

Tel: +86-21-3420-2748

Fax:

Email: hqling@sjtu.edu.cn

URL:

Platform: Institute of Microelectronic Materials and Technology

Introduction

 Teaching Involvements
 Solid physics, Principles of Microelectronic Fabrication

Biographical Information

 2003 - presentLecturer
 School of Materials Science and Engineering
 Shanghai Jiao Tong University
 1998 – 2003Nanjing University
 Department of Materials Science and Engineering
 Doctor’s degree awarded by the University in 2003
 1994 - 1998Nanjing University
 Department of Materials Science and Engineering
 BA awarded by the University in 1998

Research Interests

Solid physics, Principles of Microelectronic Fabrication

 

Selected Publications

 [1] Huiqin Ling, Qun Liu, Chengkang Chang and Dali Ma, Preparation of Calcium Silicate Nanobelts and the In Vitro Behavior in a Simulated Body Fluid. Chemistry Letters, 36, (9): 1090, 2007.
 [2] Huiqin Ling, Xubin Lu, Aidong Li, et al., Characteristics of LaAlO3 gate dielectrics on Si grown by metalorganic chemical vapor deposition, Applied Physics A-Materials Science & Processing
 [3] Tao Hang, Huiqin Ling,ZhengjiXiu, Ming Li and Dali Mao, Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed PdPreplatedLeadframes, Journal of Electronic Materials, 36, (12), 1594, 2007.
 [4] Huiqin Ling, Haiyong Cao, YuliangGuo, Han Yu, Ming Li, Dali Mao, Influence of Leveler Concentration on Copper Electrodeposition for Through Silicon Via Filling,Proceedings of 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP2009), 860.

 

Research Projects

Honors & Awards


800 Dongchuan Road, Minhang District, Shanghai, China Tel: +86-21-3420-3098