Introduction

Biographical Information

2019.01-present Associate Researcher in School of Materials Science and Engineering, Shanghai Jiao Tong University

2009.04-2018.12 Assistant Researcher in School of Materials Science and Engineering, Shanghai Jiao Tong University

2005.02-2009.03 Ph.D in School of Materials Science and Engineering, Shanghai Jiao Tong University

2002.09-2005.02 Master in School of Materials Science and Engineering, Jiangsu University of Science and Technology

1998.09-2002.07 Bachelor in School of Materials Science and Engineering, Jiangsu University of Science and Technology

Research Interests

Reliability of Micro/Nano joint, Simulation for welding and joining

Selected Publications

[1] Dezhi Yang, Chen Hua, Shengzhi Qu, Jijin Xu, Junmei Chen, Chun Yu*, Hao Lu*. Isothermal transformation of γ-Co to ε-Co in Stellite 6 coatings. Metallurgical and Materials Transactions A 50A (2019) 1153-1161.

[2] Qingzhao Wang, Maolong Zhang, Weihua Liu, Xiao Wei, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Cr or C controlled formation of transition martensite in dissimilar metal weld. Materials Characterization 147 (2019) 434–442.

[3] Chen Hua, Hao Lu*, Chun Yu*, Junmei Chen, Maolong Zhang, Dayong Li. Reduction of Laves phase in nickel alloy welding process under ultrasonic ampere force. Journal of Materials Processing Tech 252(2018)389-397.

[4] Jijin Xu, Jingyao Chen, Chun Yu*, Yi Duan, Junmei Chen, Hao Lu*. Comparison of residual stress induced by TIG and LBW in girth weld of AISI 304 stainless steel pipes. Journal of Materials Processing Tech. 248(2017) 178-184.

[5] Qingzhao Wang, Maolong Zhang, Weihua Liu, Xiao Wei, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Study of type-II boundary behavior during SA508-3EQ309L overlay weld interfacial failure process. Journal of Materials Processing Tech. 247(2017) 64-72.

[6] Chen Hua, Hao Lu, Chun Yu*, Jun-Mei Chen, Xiao Wei, Ji-jin Xu. Reduction of ductility-dip cracking susceptibility by ultrasonic-assisted GTAW. Journal of Materials Processing Technology 239 (2017) 240-250.

[7] Chun Yu，Jieshi Chen，Zhewen Cheng，Yuqian Huang，Junmei Chen，Jijin Xu*，Hao Lu*，Fine grained Cu film promoting kirkendall voiding at Cu3Sn/Cu interface，Journal of Alloys and Compounds 660 (2016) 80-84.

[8] Xiao Wei, Mengjia Xu, Qingzhao Wang, Maolong Zhang, Weihua Liu, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Effect of local texture and precipitation on the ductility dip cracking of ERNiCrFe-7A Ni-based overlay. Materials and Design 110 (2016) 90-98.

[9] Jie Shi Chen, Cheng Hui Ye, Jun Mei Chen, Ji Jin Xu, Chun Yu*, Hao Lu*. Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure. Materials Letters 161 (2015) 201-204.

[10] Jie-Shi Chen, Cheng-Hui Ye, Chun Yu*, Hao Lu*. The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints. Computational Materials Science 108(2015) 1-7.

[11] Chun Yu, Yang Yang, Jieshi Chen, Jijin Xu, Junmei Chen, Hao Lu*. Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints. Materials Letters 128(2014) 9-11.

[12] Chun Yu, Dongye Wang, Jieshi Chen, Jijin Xu, Junmei Chen, Hao Lu*. Study of Cu6Sn5 and Cu3Sn growth behaviors by considering Trace Zn. Materials Letters 121(2014) 166-169. [13] Chun Yu, Jieshi Chen, Kai-yun Wang, Jingqing Chen, Hao Lu*. Suppression effect of Cu and Ag on Cu3Sn layer in solder joints. Journal of Materials Science: Materials in Electronics 24(2013) 4630-4635

Research Projects

Honors & Awards

“Chenxing” scholar (Class B)

Outstanding Ph.D. Graduate of Shanghai