- Provincial Base
- Others
Shanghai Key Laboratory of Materials Laser Processing and Modification
Founded in 2007, the Shanghai Key Laboratory of Materials Laser Processing and Modification (MLPM) was approved and established by the Shanghai Science and Technology Committee.
Shanghai Key Laboratory of Advanced High-temperature Materials and Precision Forming
Shanghai Key Laboratory of Advanced High-temperature Materials and Precision Forming,approved by the Shanghai Science and Technology Committee (STCSM), was established in September 2013.
Shanghai Key Laboratory of Hydrogen Science
Shanghai Key Laboratory of Hydrogen Science was officially approved and established by the Science and Technology Commission of Shanghai Municipality in December 2021. It is the first interdisciplinary research platform committed to in-depth integration of hydrogen science in China, and a forward-looking strategic layout research platform of Shanghai and Shanghai Jiao Tong University.
Shanghai Magnesium Materials and Applied Engineering Technology Research Center (SMA)
Founded in September 2009, Shanghai Magnesium Materials and Applied Engineering Technology Research Center (SMA) is a research and development center of advanced Mg alloy materials officially approved by the Shanghai Municipal Science and Technology Commission.
Shanghai Experimental Teaching Demonstration Center
Shanghai Experimental Teaching Demonstration Center was found in 2020.
Joint Research Center for Additive Manufacturing
The Joint Research Center for Additive Manufacturing aims to break through the key technologies of additive manufacturing materials development and form application-oriented core processes of additive manufacturing, which is a key initiative for the construction of the discipline of additive manufacturing in the School of Materials Science and Engineering.
Joint Research Center for Intelligent Thermal Manufacturing
The Intelligent Manufacturing Joint Research Center focuses on the research and development of numerical simulation and simulation technology of the thermal manufacturing process. Employing material genome method and artificial intelligence based on big data acquisition, and integrating basic processes such as casting, welding, forging, and thermal treatment, the center carries out intelligent thermal manufacturing research and discipline construction, promotes structural adjustment and transformation, and upgrading scientific research in traditional material processing engineering of the School of Materials Science and Engineering, and solves major scientific and engineering problems that restrict intelligent manufacturing of high-end equipment for major projects.
Joint Research Center for Clean Energy Materials
The Joint Research Center for Clean Energy Materials focuses on the conversion and storage of new energy. Responding to the national green and low-carbon strategy, and addressing the environmental problems that may be caused by the increasingly scarce fossil energy and its combustion, the center focuses on prospective basic research with a balance of applied basic research.
Joint Research Center for Biomedical Materials
Based on the research directions of materials science and engineering and biomedical engineering, the Joint Research Center for Biomedical Materials has formed 4-5 cross-research directions, created a relaxed environment, gathered world-class scientific research teams, encouraged and supported original research based on new principles, discoveries, mechanisms, and materials, and carried out major innovative research with interdisciplinary collaboration on a large scale to achieve core technological breakthroughs with international influence.
Joint Research Center for Information Materials
The Joint Research Center for Information Materials focuses on the national demand for information materials in high-end chips and intelligent manufacturing, and conducts basic theoretical research and applied technology research on common key materials and technologies such as 3D chip integration and packaging, third-generation semiconductor power devices, high-density electronic interconnection molding, optoelectronic devices, automotive electronics, and new sensors.