The Joint Research Center for Information Materials focuses on the national demand for information materials in high-end chips and intelligent manufacturing, and conducts basic theoretical research and applied technology research on common key materials and technologies such as 3D chip integration and packaging, third-generation semiconductor power devices, high-density electronic interconnection molding, optoelectronic devices, automotive electronics, and new sensors. The center works closely with key national IC manufacturing companies such as SMIC, Huawei, Changdian Technology and Huatian Technology, and relies on the School of Materials Science and Engineering to establish a widely joint R&D platform for electronic information materials and technologies.

Research Directions

(1) 3D electronic materials and technologies: micro and nano 3D electronic interconnect materials, 3D memory chip technology

(2) flexible electronic materials: inorganic flexible electronic materials, transparent flexible electronic materials, degradable flexible electronic materials

(3) Advanced electronic thermal management materials: thermal management materials and devices, thermal management application technology