Introduction
Teaching Involvements
Solid physics, Principles of Microelectronic Fabrication
Biographical Information
2003 - presentLecturer
School of Materials Science and Engineering
Shanghai Jiao Tong University
1998 – 2003Nanjing University
Department of Materials Science and Engineering
Doctor’s degree awarded by the University in 2003
1994 - 1998Nanjing University
Department of Materials Science and Engineering
BA awarded by the University in 1998
Research Interests
Solid physics, Principles of Microelectronic Fabrication
Selected Publications
[1] Huiqin Ling, Qun Liu, Chengkang Chang and Dali Ma, Preparation of Calcium Silicate Nanobelts and the In Vitro Behavior in a Simulated Body Fluid. Chemistry Letters, 36, (9): 1090, 2007.
[2] Huiqin Ling, Xubin Lu, Aidong Li, et al., Characteristics of LaAlO3 gate dielectrics on Si grown by metalorganic chemical vapor deposition, Applied Physics A-Materials Science & Processing
[3] Tao Hang, Huiqin Ling,ZhengjiXiu, Ming Li and Dali Mao, Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed PdPreplatedLeadframes, Journal of Electronic Materials, 36, (12), 1594, 2007.
[4] Huiqin Ling, Haiyong Cao, YuliangGuo, Han Yu, Ming Li, Dali Mao, Influence of Leveler Concentration on Copper Electrodeposition for Through Silicon Via Filling，Proceedings of 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP2009), 860.