School of Materials Science and Engineering - Shanghai JiaoTong University

Institute of Electronic Materials and Technology

Institute of Electronic Materials and Technology (IEMT), which is affiliated to School of Materials Science and Engineering (SMSE) of Shanghai Jiao Tong University (SJTU), was established in 2003 by the former dean Prof. Dali MAO and distinguished prof. Xiangfu ZONG. IEMT’s excellence is ensured by its eminent innovative team, which consists of three professors (Prof. Liancheng ZHAO, academician of Chinese Academy of Engineering; Prof. Ming LI, the director of the institute and Prof. Tao HANG), five associate professors and more than 50 graduate students. The laboratory of IEMT now covers an area of 500 square meters, including a 200 square meters clean room, which is fully equipped with a wide range of advanced facilities for fabrication and characterization of electronic materials.

Contacts：Tao HANG

Tel：021- 34202740

Email：hangtao@sjtu.edu.cn

In recent five years, IEMT has undertaken more than 50 research projects, including the National Science and Technology Major Project, the National Basic Research Program (973 Program), the Major project of the National Natural Science Fund, and some cooperation fund with international and domestic and enterprise. IEMT has acquired a series of achievements in the area of interconnection materials and technology for high speed transmission, Super-conformal organic thin film insulator from aqueous grafting, and low-temperature bonding based on nano-array materials, which attract extensive attention from the academia at home and abroad.

IEMT has established long-term collaborations with many famous universities and companies, including Northwestern University (USA), University of Tokyo (Japan), Waseda University (Japan), the Western Digital, Dow Chemical, Siemens, Infineon, Heraeus, Air Liquide, Huawei, SMIC, Shanghai Sinyang Semiconductor Materials Co., Ltd., and etc.

Main Research Fields:

High Aspect Ratio TSV Interconnection
High Speed Interconnection Materials
High Density Micro Bump Materials
Low Temperature Bonding Technology
Grafting of Organic Insulating Thin Films
High-reliability Nanostructured Substrate

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